Ultraviolet laser precision machining system DirectLaser S5 uses an ultraviolet laser, which uses ultraviolet laser to cut and remove materials, and has the following characteristics
1. Due to the high absorption rate of various materials for ultraviolet laser, ultraviolet processing has a wide range of material processing applicability
2. The processing adopts non-contact processing without defects caused by mechanical stress.
3. The high energy characteristic of ultraviolet laser can directly destroy molecular chains or atomic bonds, and has the characteristics of low heat and small influence area
4. Short wavelength, can achieve a smaller spot, can process smaller holes or slits.
5. Semiconductor pumped solid-state laser, high conversion efficiency, low system power consumption, more environmentally friendly.
Technical Parameters |
DirectLaser S5 |
Host size (width x height x thickness) |
1250x1800x1650mm |
Processing range |
500x520mm |
Resolution |
1um |
Repeat accuracy |
±2um |
Laser model |
Awave |
Laser class |
Level 1 |
Output Power |
17W@ 30KHz |
wavelength |
355nm |
power supply |
380V/16A, 50Hz |
Power supply |
3KW |
Fan power |
1.5KW |
Flow |
200 m^3 /h |
Vacuum cleaner size (width x height x thickness) |
470x1000x480mm |
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